A new microwave integration technology of electroplating is proposed, which combines formation and mounting of multilayer structures. It uses a minimal amount of flanges in the waveguide communication lines for extra-high frequency (EHF), and is capable also to integrate the metallic and non-metallic parts into the waveguide structure with no detachable elements. Products’ weight and dimensions were significantly reduced while ensuring their sufficient rigidity and strength. The mechanical machining, gold and silver coatings were totally excluded; components’ and units’ parameters were improved. The settings and adjustment of the finished product were greatly simplified.